| Autor: |
Rui Zheng, Jian-ping Lin, Pei-Chung Wang, Yong-Rong Wu |
| Jazyk: |
angličtina |
| Rok vydání: |
2015 |
| Předmět: |
|
| Zdroj: |
Defence Technology, Vol 11, Iss 3, Pp 220-228 (2015) |
| Druh dokumentu: |
article |
| ISSN: |
2214-9147 |
| DOI: |
10.1016/j.dt.2015.01.005 |
| Popis: |
The effect of hot-humid exposure (i.e., 40 °C and 98% R.H.) on the quasi-static strength of the adhesive-bonded aluminum alloys was studied. Test results show that the hot-humid exposure leads to the significant decrease in the joint strength and the change of the failure mode from a mixed cohesive and adhesive failure with cohesive failure being dominant to adhesive failure being dominant. Careful analyses of the results reveal that the physical bond is likely responsible for the bond adhesion between L adhesive and aluminum substrates. The reduction in joint strength and the change of the failure mode resulted from the degradation in bond adhesion, which was primarily attributed to the corrosion of aluminum substrate. In addition, the elevated temperature exposure significantly accelerated the corrosion reaction of aluminum, which accelerated the degradation in joint strength. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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