Area-Selective Atomic Layer Deposition of Ru Using Carbonyl-Based Precursor and Oxygen Co-Reactant: Understanding Defect Formation Mechanisms

Autor: Jayant Kumar Lodha, Johan Meersschaut, Mattia Pasquali, Hans Billington, Stefan De Gendt, Silvia Armini
Jazyk: angličtina
Rok vydání: 2024
Předmět:
Zdroj: Nanomaterials, Vol 14, Iss 14, p 1212 (2024)
Druh dokumentu: article
ISSN: 2079-4991
DOI: 10.3390/nano14141212
Popis: Area selective deposition (ASD) is a promising IC fabrication technique to address misalignment issues arising in a top–down litho-etch patterning approach. ASD can enable resist tone inversion and bottom–up metallization, such as via prefill. It is achieved by promoting selective growth in the growth area (GA) while passivating the non-growth area (NGA). Nevertheless, preventing undesired particles and defect growth on the NGA is still a hurdle. This work shows the selectivity of Ru films by passivating the Si oxide NGA with self-assembled monolayers (SAMs) and small molecule inhibitors (SMIs). Ru films are deposited on the TiN GA using a metal-organic precursor tricarbonyl (trimethylenemethane) ruthenium (Ru TMM(CO)3) and O2 as a co-reactant by atomic layer deposition (ALD). This produces smooth Ru films (2 3D patterned structures using dimethyl amino trimethyl silane (DMA-TMS) as SMI.
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