Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

Autor: Ramli M.I.I., Mohd Salleh M.A.A., Derman M.N., Said R.M., Saud N.
Jazyk: English<br />French
Rok vydání: 2016
Předmět:
Zdroj: MATEC Web of Conferences, Vol 78, p 01064 (2016)
Druh dokumentu: article
ISSN: 2261-236X
DOI: 10.1051/matecconf/20167801064
Popis: The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
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