Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

Autor: Xingliang Liu, Guiyun Tian, Yu Chen, Haoze Luo, Jian Zhang, Wuhua Li
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: Energies, Vol 13, Iss 10, p 2613 (2020)
Druh dokumentu: article
ISSN: 13102613
1996-1073
DOI: 10.3390/en13102613
Popis: In this paper, a non-contact degradation evaluation method for insulated gate bipolar transistor (IGBT) modules is proposed based on eddy current pulsed thermography approach. In non-contact heat excitation procedures, a high-power induction heater is introduced to generate heat excitation in IGBT modules. The thermographs of the whole temperature mapping are recorded non-invasively by an IR camera. As a result, the joint degradation of IGBT modules can be evaluated by the transient thermal response curves derived from the recorded thermographs. Firstly, the non-destructive evaluation principle of the eddy current pulsed thermography (ECPT) system for an IGBT module with a heat sink is introduced. A 3D simulation module is built with physical parameters in ANSYS simulations, and then thermal propagation behavior considering the degradation impact is investigated. An experimental ECPT system is set up to verify the effectiveness of the proposed method. The experimental results show that the delay time to peak temperature can be extracted and treated as an effective indicative feature of joint degradation.
Databáze: Directory of Open Access Journals
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