Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

Autor: B. Chad Hornbuckle, Cyril L. Williams, Steven W. Dean, Xuyang Zhou, Chaitanya Kale, Scott A. Turnage, John D. Clayton, Gregory B. Thompson, Anit K. Giri, Kiran N. Solanki, Kristopher A. Darling
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: Communications Materials, Vol 1, Iss 1, Pp 1-6 (2020)
Druh dokumentu: article
ISSN: 2662-4443
DOI: 10.1038/s43246-020-0024-3
Popis: Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.
Databáze: Directory of Open Access Journals