The Roadmap of 2D Materials and Devices Toward Chips

Autor:	Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Chen Hu, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian-Ling Ren
Jazyk:	angličtina
Rok vydání:	2024
Předmět:	Two-dimensional materials Roadmap Integrated circuits Post-Moore era Technology
Zdroj:	Nano-Micro Letters, Vol 16, Iss 1, Pp 1-96 (2024)
Druh dokumentu:	article
ISSN:	2311-6706 2150-5551
DOI:	10.1007/s40820-023-01273-5
Popis:	Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/310f190895b3498ea432b3ebb33253d3 Zobrazit plný text záznamu View record in DOAJ Plný text ve formátu PDF Plný text ve formátu HTML
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