Autor: |
Qian Zhang, Qipeng Liu, Yufei Gao, Mei Xiong, Pan Ying, Xiaozhe Cheng, Qisong Li, Ziqi Wang, Yunchao Mu, Zhixin Wang, Quan Huang |
Jazyk: |
angličtina |
Rok vydání: |
2024 |
Předmět: |
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Zdroj: |
Results in Physics, Vol 62, Iss , Pp 107800- (2024) |
Druh dokumentu: |
article |
ISSN: |
2211-3797 |
DOI: |
10.1016/j.rinp.2024.107800 |
Popis: |
Novel semiconductor material with both high strength and ductility is urgently needed to meet the demands of increasing complex applications for electronic components. However, overcoming the inherent trade-off between strength and ductility has remained a longstanding challenge in materials science research. Herein, we proposed a three-dimensional carbon allotrope, oc-C24 with pure sp2 hybridization. This structure comprises arrays of carbon chains in an “8”-shape helix configuration, in between the C-chains which interlinked by the oriented ethylene with a planar π-conjugation. The distinctive structural unit imbues oc-C24 with remarkable tensile behavior, characterized by multi-stage chemical bond rearrangements and structural phase transitions along [010] crystallographic direction, displaying multi-level stress re-enhancement phenomena. A tensile strength of 104.2 GPa and a record strain of 1.05 are observed along [010] direction. Electronic band analysis reveals that oc-C24 is a semiconductor with an indirect band gap of 2.91 eV. The impressive tensile resistance and ductility of oc-C24 suggest its strong potential applications in electronic devices under extreme conditions. Our findings offer valuable insights and methodological strategies for designing novel carbon allotropes with unique mechanical responses. |
Databáze: |
Directory of Open Access Journals |
Externí odkaz: |
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