Autor: |
Dirk Jonker, Erwin J. W. Berenschot, Niels R. Tas, Roald M. Tiggelaar, Arie van Houselt, Han J. G. E. Gardeniers |
Jazyk: |
angličtina |
Rok vydání: |
2022 |
Předmět: |
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Zdroj: |
Nanoscale Research Letters, Vol 17, Iss 1, Pp 1-16 (2022) |
Druh dokumentu: |
article |
ISSN: |
1556-276X |
DOI: |
10.1186/s11671-022-03735-y |
Popis: |
Abstract Convex cylindrical silicon nanostructures, also referred to as silicon nanocones, find their value in many applications ranging from photovoltaics to nanofluidics, nanophotonics, and nanoelectronic applications. To fabricate silicon nanocones, both bottom-up and top-down methods can be used. The top-down method presented in this work relies on pre-shaping of silicon nanowires by ion beam etching followed by self-limited thermal oxidation. The combination of pre-shaping and oxidation obtains high-density, high aspect ratio, periodic, and vertically aligned sharp single-crystalline silicon nanocones at the wafer-scale. The homogeneity of the presented nanocones is unprecedented and may give rise to applications where numerical modeling and experiments are combined without assumptions about morphology of the nanocone. The silicon nanocones are organized in a square periodic lattice, with 250 nm pitch giving arrays containing 1.6 billion structures per square centimeter. The nanocone arrays were several mm2 in size and located centimeters apart across a 100-mm-diameter single-crystalline silicon (100) substrate. For single nanocones, tip radii of curvature |
Databáze: |
Directory of Open Access Journals |
Externí odkaz: |
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