Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
| Autor: | Junhyuk Son, Dong-Yurl Yu, Min-Su Kim, Yong-Ho Ko, Dong-Jin Byun, Junghwan Bang |
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| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: | |
| Zdroj: | Metals, Vol 11, Iss 2, p 210 (2021) |
| Druh dokumentu: | article |
| ISSN: | 11020210 2075-4701 |
| DOI: | 10.3390/met11020210 |
| Popis: | The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240–300 °C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 °C in both the solders, and the particle size increased at 280 and 300 °C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components. |
| Databáze: | Directory of Open Access Journals |
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