| Autor: |
Nguyen Van Toan, Shim Hahng, Yunheub Song, Takahito Ono |
| Jazyk: |
angličtina |
| Rok vydání: |
2016 |
| Předmět: |
|
| Zdroj: |
Micromachines, Vol 7, Iss 5, p 76 (2016) |
| Druh dokumentu: |
article |
| ISSN: |
2072-666X |
| DOI: |
10.3390/mi7050076 |
| Popis: |
This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 × 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 µm and sensing gap of 3.2 µm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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