| Autor: |
Mardiana Said, Nurulakmal Mohd Sharif, Muhammad Firdaus Mohd Nazeri, Soorathep Kheawhom, Ahmad Azmin Mohamad |
| Jazyk: |
angličtina |
| Rok vydání: |
2022 |
| Předmět: |
|
| Zdroj: |
Journal of Materials Research and Technology, Vol 17, Iss , Pp 1438-1449 (2022) |
| Druh dokumentu: |
article |
| ISSN: |
2238-7854 |
| DOI: |
10.1016/j.jmrt.2022.01.085 |
| Popis: |
Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by conventional reflow and MHH. The conventional reflow oven was set to 260 °C at 60 s holding time, and MHH was carried out at high operating power at 40 s. The reflowed sample was isothermally aged at 150 °C for various aging times (0, 240, 480 and 960 h) in a laboratory oven. The conventional reflow and MHH transformed the IMC structure from scallop-like to a planar-like Cu6Sn5 with a linear increase in thickness and a thin layer of Cu3Sn was observed at 240 h of aging. While Ag3Sn particles grew larger at longer aging time. The MHH shows a thinner Cu6Sn5 layer, and a smaller grain size compared to conventional reflow. The ultimate tensile strength (UTS) for conventional reflow (32.7 MPa) is 26.8% lower compared to MHH (44.7 MPa). The UTS for MHH is greater than conventional reflow as the isothermal aging time increases. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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