Wetting of aluminum and copper substrates by lead – nickel melt
Autor: | A.Kh. Shermetov, A.A. Shokarov, M.Kh. Ponezhev, A.V. Sozaev, B.S. Karamurzov |
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Jazyk: | ruština |
Rok vydání: | 2018 |
Předmět: | |
Zdroj: | Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, Iss 10, Pp 671-676 (2018) |
Druh dokumentu: | article |
ISSN: | 2226-4442 2658-4360 46386696 |
DOI: | 10.26456/pcascnn/2018.10.671 |
Popis: | In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts. |
Databáze: | Directory of Open Access Journals |
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