Wetting of aluminum and copper substrates by lead – nickel melt

Autor: A.Kh. Shermetov, A.A. Shokarov, M.Kh. Ponezhev, A.V. Sozaev, B.S. Karamurzov
Jazyk: ruština
Rok vydání: 2018
Předmět:
Zdroj: Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, Iss 10, Pp 671-676 (2018)
Druh dokumentu: article
ISSN: 2226-4442
2658-4360
46386696
DOI: 10.26456/pcascnn/2018.10.671
Popis: In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts.
Databáze: Directory of Open Access Journals