Preparation of Imidazole Compounds as Latent Curing Agents and Their Application in RGB LED Packaging
| Autor: | Jiangcong Chen, Shujuan Zhang, Biwen Li, Pinghu Chen, Hengfeng Li |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2024 |
| Předmět: |
RGB LED
non-conductive adhesives chip–substrate joint shear strength light attenuation reliability analysis Technology Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 |
| Zdroj: | Materials, Vol 17, Iss 19, p 4935 (2024) |
| Druh dokumentu: | article |
| ISSN: | 1996-1944 |
| DOI: | 10.3390/ma17194935 |
| Popis: | LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for non-conductive adhesives for an imidazole curing system. The optimized composition of the adhesive is 25%wt for the curing agent and 30%wt for the silica. The prepared non-conductive adhesive has a 7-day pot life and 9-month storage stability. The shear strength reached 87 g and 72 g at 25 °C and 160 °C, respectively. The reliability of the LED modules packaged with the non-conductive adhesive was researched. The green and blue light intensity change was 4.7%, 43.7%, respectively, indicating good anti-aging properties. The blue light decay was mainly due to adhesive aging. The non-conductive adhesive effectively prevented “caterpillar” growth. This provides useful and practical guidelines for industry for applications of adhesive in different packages. |
| Databáze: | Directory of Open Access Journals |
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