Autor: |
Ramdas P. Khade, Sujan Sarkar, Ajay Shanbhag, Amitava DasGupta, Nandita DasGupta |
Jazyk: |
angličtina |
Rok vydání: |
2023 |
Předmět: |
|
Zdroj: |
IEEE Journal of the Electron Devices Society, Vol 11, Pp 294-302 (2023) |
Druh dokumentu: |
article |
ISSN: |
2168-6734 |
DOI: |
10.1109/JEDS.2023.3275277 |
Popis: |
In this paper, kink effect observed in the output characteristics of the AlInN/GaN-on-Si high electron mobility transistor (HEMT) after subjecting the Si-substrate to positive/negative bias stress has been studied. The charge distribution in the different buffer layers of the wafer in the presence of different substrate-bias stress has been discussed in detail. It is concluded that the induced kink is due to the trapping/de-trapping of charge carriers through acceptor-like deep levels present in the GaN buffer layer. TCAD simulations have been performed to understand the electric-field distribution within the device layers, which is strongly related to the observed kink phenomenon. Two types of traps, acceptor-like (Ea1 = 0.52 eV) and donor-like (Ea2 = 0.44 eV), were extracted from temperature-dependent drain current transient analysis using back-gating experiment. It is concluded that a carbon-induced deep acceptor-like trap is responsible for the observed kink effect. |
Databáze: |
Directory of Open Access Journals |
Externí odkaz: |
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