Development of EUV interference lithography for 25 nm line/space patterns

Autor: A.K. Sahoo, P.-H. Chen, C.-H. Lin, R.-S. Liu, B.-J. Lin, T.-S. Kao, P.-W. Chiu, T.-P. Huang, W.-Y. Lai, J. Wang, Y.-Y. Lee, C.-K. Kuan
Jazyk: angličtina
Rok vydání: 2023
Předmět:
Zdroj: Micro and Nano Engineering, Vol 20, Iss , Pp 100215- (2023)
Druh dokumentu: article
ISSN: 2590-0072
DOI: 10.1016/j.mne.2023.100215
Popis: In this study, we present the performance of an extreme ultraviolet interference lithography (EUV-IL) setup that was reconstructed at Taiwan Light Source 21B2 EUV beamline in the National Synchrotron Radiation Research Center (NSRRC), Taiwan. An easy-to-perform fabrication method to produce a high-quality transmission grating mask and a simple design of experimental setup for EUV-IL were developed. The current EUV-IL setup is capable of fabricating line/space patterns down to 25 nm half-pitch in hydrogen silsesquioxane (HSQ) resist. Preliminary exposure results revealed that optimized slit width and exposure time significantly improved line/space pattern quality. The current EUV-IL tool at NSRRC can be used for nano-patterning and resist screening to advance the next generation of semiconductor devices.
Databáze: Directory of Open Access Journals