EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS
| Autor: | Samah Ihsan Adnan, Aouf Abdulrahman Ahmad, Adnan Adulamir Abdulrasool |
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| Jazyk: | Arabic<br />English |
| Rok vydání: | 2020 |
| Předmět: | |
| Zdroj: | Journal of Engineering and Sustainable Development, Vol 24, Iss 02, Pp 18-29 (2020) |
| Druh dokumentu: | article |
| ISSN: | 2520-0917 2520-0925 14956195 |
| DOI: | 10.31272/jeasd.24.2.2 |
| Popis: | This;paper;presents;the;effect;of;filling;ratio;on;thermal;performance;of;a;loop;thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator. |
| Databáze: | Directory of Open Access Journals |
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