Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Autor:	Kai-Kai Xu, Liang Zhang, Li-Li Gao, Nan Jiang, Lei Zhang, Su-Juan Zhong
Jazyk:	angličtina
Rok vydání:	2020
Předmět:	low temperature solder wettability microstructure mechanical properties oxidation resistance Materials of engineering and construction. Mechanics of materials TA401-492 Biotechnology TP248.13-248.65
Zdroj:	Science and Technology of Advanced Materials, Vol 21, Iss 1, Pp 689-711 (2020)
Druh dokumentu:	article
ISSN:	1468-6996 1878-5514 14686996
DOI:	10.1080/14686996.2020.1824255
Popis:	Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/14506c1325be4474a5a46df46d0f8972 Zobrazit plný text záznamu View record in DOAJ