Design of robust and low‐loss 3‐D printed double‐ridged waveguide to microstrip transition

Autor: Jon Håvard H. Eriksrød, Kristian G. Kjelgård, Tor S. Lande
Jazyk: angličtina
Rok vydání: 2022
Předmět:
Zdroj: IET Microwaves, Antennas & Propagation, Vol 16, Iss 4, Pp 224-232 (2022)
Druh dokumentu: article
ISSN: 1751-8733
1751-8725
DOI: 10.1049/mia2.12233
Popis: Abstract In this paper, we present a new microstrip to waveguide transition design for interfacing printed circuit board (PCB) microstrip transmission lines with 3‐D printed metallised‐plastic waveguide components. Compared with traditional metal waveguides, interfacing with plastic‐based waveguides are challenging due to thermal and mechanical constraints. Despite the development of 3‐D printing technology, the precision of 3‐D printed waveguides is not as good as the machined metal counterparts. This is critical for microwave components and must be considered in the design process. To minimise the effect of non‐ideal waveguide components, a design methodology minimising sensitivity to geometrical variations in the 3‐D printed parts is proposed. By sandwiching the PCB between two waveguide sections and optimising the waveguide impedance transformation geometry, the design shows very low insertion loss. It is mechanically robust, cost effective and simple to manufacture. In full system integration, this transition design eliminates the need for expensive microwave cabling and connectors by directly mounting the waveguide to the microwave transceiver PCB. The proof‐of‐concept transition structure presented in this paper is suitable for microwave applications where low cost and low weight are critical, for example, drone‐based radars for remote sensing and space‐born satellites. The fabricated structure is characterised using two sets of waveguide components manufactured with different 3‐D printing technology and metallisation process': conductive spray painted Fused Deposition Modelling—Polylactic Acid (PLA Painted) and copper electroplated Stereolithography (SLA Plated). Scattering parameters for both types are measured in a short and back‐to‐back configuration, obtaining the reflection coefficient and insertion loss. Measurements indicate good agreement with modelling and measured performance exceeding prior art. The measured operation band of the Copper‐SLA version is 2.9–7.2 GHz with
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