| Autor: |
Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim |
| Jazyk: |
angličtina |
| Rok vydání: |
2019 |
| Předmět: |
|
| Zdroj: |
IEEE Access, Vol 7, Pp 87907-87915 (2019) |
| Druh dokumentu: |
article |
| ISSN: |
2169-3536 |
| DOI: |
10.1109/ACCESS.2019.2925073 |
| Popis: |
In this paper, we demonstrate a V-band planar micromachined helical antenna (PHA) with end-fire radiation on the glass substrate. The planar rectangular helical configuration is realized using the novel through-glass silicon via (TGSV) technology. The proposed micromachined antenna is designed and fabricated on a borosilicate glass substrate of thickness 350 μm, which has a very low-dielectric loss compared to silicon at millimeter-wave bands. The proposed PHA is fed by a microstrip line, and the planar helical configuration with 3.25 turns with a truncated ground plane is designed for achieving wideband end-fire radiation with seven tungsten-coated silicon vias and six connected gold arm patterns, which are fabricated using the TGSV technology. The electrical length of the proposed antenna is (3 λo ×1.4 λo). The designed antenna operates at the center frequency of 58 GHz. A prototype of the proposed antenna is fabricated by micromachining technology and tested. The simulated and measured results show that the proposed antenna has a wide operational bandwidth of 50.3 to 65 GHz for |S11| |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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