Extended CT Void Analysis in FDM Additive Manufacturing Components
Autor: | Adriana Hernandez-Contreras, Leopoldo Ruiz-Huerta, Alberto Caballero-Ruiz, Verena Moock, Hector R. Siller |
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Jazyk: | angličtina |
Rok vydání: | 2020 |
Předmět: |
additive manufacturing (AM)
digital manufacturing void analysis X-ray computed tomography (CT) mechanical properties Technology Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 |
Zdroj: | Materials, Vol 13, Iss 17, p 3831 (2020) |
Druh dokumentu: | article |
ISSN: | 1996-1944 |
DOI: | 10.3390/ma13173831 |
Popis: | Additive manufacturing (AM) is the term for a number of processes for joining materials to build physical components from a digital 3D model. AM has multiple advantages over other construction techniques, such as freeform, customization, and waste reduction. However, AM components have been evaluated by destructive and non-destructive testing and have shown mechanical issues, such as reduced resistance, anisotropy and voids. The build direction affects the mechanical properties of the built part, including voids of different characteristics. The aim of this work is an extended analysis of void shape by means of X-ray computed tomography (CT) applied to fused deposition modeling (FDM) samples. Furthermore, a relation between the tensile mechanical properties and digital void measurements is established. The results of this work demonstrate that void characteristics such as quantity, size, sphericity and compactness show no obvious variations between the samples. However, the angle between the main void axis and the mechanical load axis α shows a relation for FDM components: when its mean value μ(α) is around 80 (degrees) the yield strength and Young’s modulus are reduced. These results lead to the formulation of a novel criterion that predicts the mechanical behavior of AM components. |
Databáze: | Directory of Open Access Journals |
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