A multi-channel silicon package for large-scale skipper-CCD experiments
Autor: | Botti, A. M., Chavez, C., Sofo-Haro, M., Miller, C. S., Chierchie, F., Jonas, M., Lisovenko, M., Gutti, H., Czaplewski, D., Lathrop, A., Tiffenberg, J., Fernandez-Moroni, G., Estrada, J. |
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Rok vydání: | 2024 |
Předmět: | |
Druh dokumentu: | Working Paper |
Popis: | The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present the design, fabrication, testing, and empirical signal model of a multi-channel silicon package. In addition, we outline the chosen specifications for the ongoing production of 1500 wafers that will add up to a 10 kg skipper-CCD array with 24000 readout channels. Comment: 14 pages, 13 figures, 2 tables |
Databáze: | arXiv |
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