Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor
| Autor: | Kosen, Sandoko, Li, Hang-Xi, Rommel, Marcus, Shiri, Daryoush, Warren, Christopher, Grönberg, Leif, Salonen, Jaakko, Abad, Tahereh, Biznárová, Janka, Caputo, Marco, Chen, Liangyu, Grigoras, Kestutis, Johansson, Göran, Kockum, Anton Frisk, Križan, Christian, Lozano, Daniel Pérez, Norris, Graham, Osman, Amr, Fernández-Pendás, Jorge, Ronzani, Alberto, Roudsari, Anita Fadavi, Simbierowicz, Slawomir, Tancredi, Giovanna, Wallraff, Andreas, Eichler, Christopher, Govenius, Joonas, Bylander, Jonas |
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| Rok vydání: | 2021 |
| Předmět: | |
| Zdroj: | Quantum Science and Technology, 7(3), 035018 (2022) |
| Druh dokumentu: | Working Paper |
| DOI: | 10.1088/2058-9565/ac734b |
| Popis: | We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\,\mu s$, single-qubit gate fidelities exceeding $99.9\%$, and two-qubit gate fidelities above $98.6\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers. Comment: 33 pages, 12 figures, includes supplementary materials, updated with further calculations on participation ratio and Purcell limit |
| Databáze: | arXiv |
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