Effect of skin-to-skin contact on stimulation threshold and dosimetry

Autor: Rashed, Essam A., Diao, Yinliang, Tanaka, Shota, Sakai, Takashi, Gomez-Tames, Jose, Hirata, Akimasa
Rok vydání: 2020
Předmět:
Zdroj: IEEE Transactions on Electromagnetic Compatibility, 2020
Druh dokumentu: Working Paper
DOI: 10.1109/TEMC.2020.2985404
Popis: The human dosimetry for electromagnetic field exposure is an essential task to develop exposure guidelines/standards for human safety as well as product safety assessment. At frequencies from a few hundred Hz to 10 MHz, the adverse effect to be protected is the stimulation of the peripheral nervous system. The in situ electric field in the skin is used as a surrogate of nerve activation. In the low-frequency dosimetry, a high but inaccurate in situ electric field has been reported at positions where a skin-to-skin contact exists, whose relation to the stimulation is controversial. One of the reasons for high electric fields may be attributable to the current resolution of anatomical models. In this study, we first evaluate the stimulation threshold at postures of skin-to-skin contact experimentally for different hand/finger positions to represent skin touching/non-touching scenarios. We confirm that the skin-to-skin contact does not lower the threshold current of magnetic stimulation devices needed to induce pain. Second, a new method is proposed for hand modeling to configure different finger positions using static hand models with similar postures to the experiments. We compute the in situ electric field at skin-to-skin contact for the different hand posture scenarios that indicate an excessive raise of the electric field in skin-to-skin regions that is not justified by the experiments. The comparison suggests that a high in situ electric field in the skin would be caused by poor modeling of the skin layers, which is not enough to represent in a resolution of the order of a millimeter. This skin-to-skin contact should not be considered to set the restriction in the international exposure guidelines/standards as well as product safety assessment.
Comment: Submitted to IEEE TEMC
Databáze: arXiv