| Autor: |
Fomra, Dhruv, Secondo, Ray, Ding, Kai, Avrutin, Vitaliy, Izyumskaya, Natalia, Özgür, Ümit, Kinsey, Nathaniel |
| Rok vydání: |
2019 |
| Předmět: |
|
| Druh dokumentu: |
Working Paper |
| DOI: |
10.1063/1.5130889 |
| Popis: |
To integrate plasmonic devices into industry, it is essential to develop scalable and CMOS compatible plasmonic materials. In this work, we report high plasmonic quality titanium nitride (TiN) on c-plane sapphire by plasma enhanced atomic layer deposition (PE-ALD). TiN with low losses and high metallicity was achieved at temperatures below 500{\deg}C, by exploring the effects of chemisorption time, substrate temperature and plasma exposure time on material properties. Reduction in chemisorption time mitigates premature precursor decomposition at T_S > 375{\deg}C , and a trade-off between reduced impurity concentration and structural degradation caused by plasma bombardment is achieved for 25s plasma exposure. 85 nm thick TiN films grown at a substrate temperature of 450{\deg}C, compatible with CMOS processes, with 0.5s chemisorption time and 25s plasma exposure exhibited a high plasmonic figure of merit (|{\epsilon}^'/{\epsilon}^''|) of 2.8 and resistivity of 31 {\mu}{\Omega}-cm. These TiN thin films fabricated with subwavelength apertures were shown to exhibit extraordinary transmission. |
| Databáze: |
arXiv |
| Externí odkaz: |
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