Diffusion-controlled growth of phases in metal-tin systems related to microelectronics packaging

Autor:	Baheti, Varun A
Rok vydání:	2018
Předmět:	Physics - Applied Physics
Druh dokumentu:	Working Paper
Popis:	The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in the solid–state during storage at room temperature and service at an elevated temperature leading to degradation of the contacts. In this thesis, the diffusion–controlled growth mechanism of the phases and the formation of the Kirkendall voids at the interface of UBM (Cu, Ni, Au, Pd, Pt) and Sn (bulk/electroplated) are studied extensively. Comment: PhD Thesis from Professor Aloke Paul group at the Department of Materials Engineering of the Indian Institute of Science (IISc), Bangalore, INDIA
Databáze:	arXiv
Externí odkaz:	http://arxiv.org/abs/1804.09595 Zobrazit plný text záznamu View this record from Arxiv