Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector
| Autor: | Kremastiotis, I., Ballabriga, R., Campbell, M., Dannheim, D., Fiergolski, A., Hynds, D., Kulis, S., Peric, I. |
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| Rok vydání: | 2017 |
| Předmět: | |
| Druh dokumentu: | Working Paper |
| DOI: | 10.1088/1748-0221/12/09/P09012 |
| Popis: | The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial $180$ nm HV-CMOS process and contains a matrix of $128\times128$ square pixels with $25$ $\mu$m pitch. First prototypes have been produced with a standard resistivity of $\sim20$ $\Omega$cm for the substrate and tested in standalone mode. The results show a rise time of $\sim20$ ns, charge gain of $190$ mV/ke$^{-}$ and $\sim40$ e$^{-}$ RMS noise for a power consumption of $4.8$ $\mu$W/pixel. The main design aspects, as well as standalone measurement results, are presented. Comment: 13 pages, 13 figures, 2 tables. Work carried out in the framework of the CLICdp collaboration |
| Databáze: | arXiv |
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