| Autor: |
Ma, Rongchao, Guo, Cangran, Zhou, Yixin, Liu, Jing |
| Rok vydání: |
2013 |
| Předmět: |
|
| Druh dokumentu: |
Working Paper |
| Popis: |
The room temperature liquid metal related electronics has been found important in a wide variety of emerging areas over the past few years. However, its failure features under high electrical current densities are not clear until now. Here we show that a liquid metal thin film would break-up as the applied current increases to a critical magnitude. The break-up phenomenon is attributed to be caused by the so-called electromigration effect. This problem could be one of the major hurdles that must be tackled with caution in the research and application of future liquid metal film electronics. |
| Databáze: |
arXiv |
| Externí odkaz: |
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