A Two-Step Etching Method to Fabricate Nanopores in Silicon

Autor:	Wang, G. -J., Chen, W. -Z., Chang, K. J.
Rok vydání:	2008
Předmět:	Computer Science - Other Computer Science
Zdroj:	Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Druh dokumentu:	Working Paper
Popis:	A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon. Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
Databáze:	arXiv
Externí odkaz:	http://arxiv.org/abs/0802.3087 Zobrazit plný text záznamu View this record from Arxiv