Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

Autor:	Szucs, Z., Nagy, G., Hodossy, S., Rencz, M., Poppe, A.
Rok vydání:	2008
Předmět:	Physics - General Physics
Zdroj:	Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
Druh dokumentu:	Working Paper
Popis:	In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples. Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
Databáze:	arXiv
Externí odkaz:	http://arxiv.org/abs/0801.1030 Zobrazit plný text záznamu View this record from Arxiv