Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array
Autor: | Bognar, Gy., Szekely, V., Rencz, M. |
---|---|
Rok vydání: | 2007 |
Předmět: | |
Zdroj: | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006) |
Druh dokumentu: | Working Paper |
Popis: | In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack. Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions) |
Databáze: | arXiv |
Externí odkaz: |