Localized Lna Cooling in Vacuum
| Autor: | Schreuder, F., De Vaate, J. -G. Bij |
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| Rok vydání: | 2007 |
| Předmět: | |
| Zdroj: | Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006) |
| Druh dokumentu: | Working Paper |
| Popis: | In the Square Kilometre Array (SKA) telescope [1], [2], the noise temperature of the first LNA must be reduced in order to reduce the necessary active area and the total system costs. Cooling the LNA locally would significantly decrease the noise figure but also the necessary power since not the whole system has to be cooled. For optimal thermal isolation, an LNA chip which only needs 6 bondwires has been chosen, 4 Ground and 2 signal wires. Biasing occurs on-chip. If the bondwires are 1.5mm long, the total heat conduction of the 6 bondwires is 31 mW, which is added to the power consumption of the LNA (30 mW). With a power of 61 mW to cool, the Peltier element can achieve a -T of 60K. With this system, a noise reduction of 30% has been measured with 0.5W of electrical power. For 15% noise reduction, only 35mW of electrical power was needed. Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions) |
| Databáze: | arXiv |
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