EFFECT OF DRYING TYPES AND POLYSTYRENE DENSITY ON THERMAL CONDUCTIVITY OF POLYSTYRENE COMPOSITE PARTICLEBOARD
| Autor: | ÖZTÜRK, Hasan, ÇOLAKOĞLU, Gürsel, DEMİRKIR, Cenk |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2019 |
| Předmět: | |
| Zdroj: | Volume: 1, Issue: 2 57-62 Wood Industry and Engineering |
| ISSN: | 2687-6043 2687-6035 |
| Popis: | Thermal conductivity of wood material is superior to other buildingmaterials because of its porous structure. Thermal conductivity is a veryimportant parameter in determining heat transfer rate and is required fordevelopment of drying models in industrial operations such as adhesive curerate. Thermal conductivity is used to estimate the ability of insulation ofmaterial. Thermal conductivity of wood material has varied according to woodspecies, direction of wood fiber, resin type, and addictive members used inmanufacture of wood composite panels. The aim of the study is to produce a new wood composite material withinsulating properties by using insulating material called as polystyreneinstead of formaldehyde based adhesives as bonding material. Five differentwood species (beech, poplar, alder, pine, spruce), six different polystyrenespecies with different density values were used in this study and three layersparticleboard in 18 mm thickness was produced. Urea formaldehyde resin (UF) wasused in conventional panels manufacturing as adhesive. Technical drying wasapplied half of the test groups, while the other group was conditioned untilreach to 12% equilibrium moisture content at room temperature as natural beforemanufacturing process to determine the effect of drying. The thermalconductivity of new composite panels were determined according to ASTM C 518& ISO 8301. According to the results from the study, thermal conductivity valuesobtained from natural drying were found to be higher than technical drying. Thetype of binder that gives the lowest thermal conductivity values among treespecies in natural drying is generally S5. The lowest values in technicaldrying were obtained from panels bonded with XPS. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|