Three-dimensional wavelength-division multiplexing interconnects based on a low-loss Si

Autor: Jaegyu, Park, Jiho, Joo, Myung-Joon, Kwack, Gyungock, Kim, Sang-Pil, Han, Sungil, Kim
Rok vydání: 2021
Zdroj: Optics express. 29(22)
ISSN: 1094-4087
Popis: We fabricate three-dimensional wavelength-division multiplexing (3D-WDM) interconnects comprising three Si
Databáze: OpenAIRE