Adhesion of resin composite core materials to dentin
Autor: | K L, O'Keefe, J M, Powers |
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Rok vydání: | 2002 |
Předmět: |
Analysis of Variance
Polymers Surface Properties Statistics as Topic Dental Bonding Composite Resins Resin Cements Acid Etching Dental Polymethacrylic Acids Dentin-Bonding Agents Dentin Materials Testing Microscopy Electron Scanning Humans Fluorides Topical Molar Third Phosphoric Acids Stress Mechanical |
Zdroj: | The International journal of prosthodontics. 14(5) |
ISSN: | 0893-2174 |
Popis: | This study determined (1) the effect of polymerization mode of resin composite core materials and dental adhesives on the bond strength to dentin, and (2) if dental adhesives perform as well to dentin etched with phosphoric acid as to dentin etched with self-etching primer.Human third molars were sectioned 2 mm from the highest pulp horn and polished. Three core materials (Fluorocore [dual cured], Core Paste [self-cured], and Clearfil Photo Core [light cured]) and two adhesives (PrimeBond NT Dual Cure and Clearfil SE Bond [light cured]) were bonded to dentin using two dentin etching conditions. After storage, specimens were debonded in microtension and bond strengths were calculated. Scanning electron micrographs of representative bonding interfaces were analyzed.Analysis showed differences among core materials, adhesives, and etching conditions. Among core materials, dual-cured Fluorocore had the highest bond strengths. There were incompatibilities between self-cured Core Paste and PrimeBond NT in both etched (0 MPa) and nonetched (3.0 MPa) dentin. Among adhesives, in most cases Clearfil SE Bond had higher bond strengths than PrimeBond NT and bond strengths were higher to self-etched than to phosphoric acid-etched dentin. Scanning electron micrographs did not show a relationship between resin tags and bond strengths.There were incompatibilities between a self-cured core material and a dual-cured adhesive. All other combinations of core materials and adhesives produced strong in vitro bond strengths both in the self-etched and phosphoric acid-etched conditions. |
Databáze: | OpenAIRE |
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