Autor: |
Poya, Yasaei, Zahra, Hemmat, Cameron J, Foss, Shixuan Justin, Li, Liang, Hong, Amirhossein, Behranginia, Leily, Majidi, Robert F, Klie, Michel W, Barsoum, Zlatan, Aksamija, Amin, Salehi-Khojin |
Rok vydání: |
2018 |
Zdroj: |
Advanced materials (Deerfield Beach, Fla.). 30(43) |
ISSN: |
1521-4095 |
Popis: |
Van der Waals interactions in 2D materials have enabled the realization of nanoelectronics with high-density vertical integration. Yet, poor energy transport through such 2D-2D and 2D-3D interfaces can limit a device's performance due to overheating. One long-standing question in the field is how different encapsulating layers (e.g., contact metals or gate oxides) contribute to the thermal transport at the interface of 2D materials with their 3D substrates. Here, a novel self-heating/self-sensing electrical thermometry platform is developed based on atomically thin, metallic Ti |
Databáze: |
OpenAIRE |
Externí odkaz: |
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