Optical and surface properties of the in doped GaAs layer deposition using thermionic vacuum arc method
| Autor: | Pat S., Özen S., Şenay V., Korkmaz Ş., Şimşek V. |
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| Přispěvatelé: | Bayburt University |
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
optical properties
InGaAs surface property III/V doped semiconductor water methyl iodide Optoelectronics devices ethylene glycol indium indium arsenide Narrow band gap semiconductors Article Zinc sulfide Gallium arsenide surface tension Deposition rates Surface properties Semiconducting indium Vacuum applications physical chemistry Semiconductor doping Semiconducting gallium Deposition contact angle gallium analytic method Indium alloys Transmittance spectra arsenic Semiconductor layers Gallium alloys Crystallographic directions semiconductor optics thickness Doped semiconductors Optical transparent inorganic compound unclassified drug Vacuum technology TVA priority journal thermionic vacuum arc method formamide Thermionic vacuum arc methods |
| Popis: | A broadband optical transparent InGaAs semiconductor layer production of micron thicknesses was produced in only 75 s by thermionic vacuum arc (TVA) method at the first time. The optical and surface properties of the produced layers have been investigated. InGaAs structure is using in electronics and optoelectronics devices. The main advantage of TVA method is its fast deposition rate, without any loss in the quality of the films. Doping is a very simple and fast according to common production methods. InGaAs is an alloy of indium arsenide (InAs) and gallium arsenide (GaAs). InAs with (220) crystallographic direction and GaAs with (024)/(022) crystallographic directions were detected using by XRD analysis. GaAs and InAs are in the cubic and zinc blende crystal system, respectively. According to the transmittance spectra, sample has a broadband transparency in the range of 1000–3300 nm. According to results, defined TVA method for In doping to GaAs is proper fast and friendly method. SCANNING 38:297–302, 2016. © 2015 Wiley Periodicals, Inc. © Wiley Periodicals, Inc. |
| Databáze: | OpenAIRE |
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