| Autor: |
Hlína, Jiří, Řeboun, Jan, Hamáček, Aleš |
| Přispěvatelé: |
Fiřt, Jaroslav |
| Jazyk: |
čeština |
| Rok vydání: |
2016 |
| Předmět: |
|
| Popis: |
This paper is focused on an adhesion and solderability measuring of samples prepared by TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate and fired in nitrogen atmosphere. Oxygen level dependence on adhesion of copper film to alumina base and copper film solderability was observed in the paper. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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