Experimental Study to Reduce Residual Stresses in Bonded Patch Repair - ABSTRACT ONLY

Autor:	Li, Chun, Djokic, Drazen, Johnston, Andrew A.
Rok vydání:	2009
Předmět:	residual stresses Bonded repair
Popis:	36th International SAMPE Technical Conference From 11/15/2004 To 11/18/2004, San Diego / USA available unclassified unlimited
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=od______1674::8fe4e871af3470abe678cce02a5c67bd https://nrc-publications.canada.ca/eng/view/object/?id=9444808b-aa3c-42c4-b84c-46d07e71ae70 Zobrazit plný text záznamu