| Autor: |
Lewke, Dirk, Koitzsch, Matthias, Schellenberger, Martin, Pfitzner, Lothar, Ryssel, Heiner, Zühlke, Hans-Ulrich |
| Přispěvatelé: |
Publica |
| Jazyk: |
angličtina |
| Rok vydání: |
2012 |
| Předmět: |
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| Popis: |
The novel Thermal Laser Separation (TLS) technology allows for kerf-free dicing of brittle materials by crack guiding through thermally induced mechanical stress. Several benefits like a zero kerf and a high edge quality make it a promising technology for special applications: dicing of silicon carbide (SiC) with feed rates up to 200 mm/s, resizing of silicon wafers and dicing through pn-junctions of silicon diodes. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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