| Autor: |
Ifland, D., Ansorge, F., Baar, C., Lang, K.-D. |
| Přispěvatelé: |
Publica |
| Jazyk: |
němčina |
| Rok vydání: |
2013 |
| Popis: |
The present article deals with the development ofSys-tem-in-Package (SiP) modules, which are produced by stereolithography, an additive fabrication process. During the production process of the SIP module the necessary electrical components will be integrated into the carrier substrate. Afterwards the components will be interconnected of an electrically conductive adhesive. This method is intended to demonstrate a novel three-dimensional construction and connection technology for microsystems. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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