| Popis: |
Over the last few years, there has been increasing failure of the solder interconnections between the IC package and the printed circuit board (PCB) — generally referred to as board level interconnection — when subjected to mechanical shock such as the drop-impact of a portable electronic portable. The IC packaging industries are searching earnestly for a comprehensive solution to the problem. In this thesis project, a systematic approach has been adopted to first develop a fundamental understanding of the mechanics of shock impact on the PCB assembly and the mechanics of failure on the board level interconnection. This basic knowledge is then explored to develop guidelines for robust design and manufacturing as well as a failure model for board level solder interconnection. |
