Investigation on flip chip solder joint fatigue with cure-dependent underfill properties
| Autor: | Yang, D.G., Zhang, G.Q., Ernst, L.J., van 't Hof, C., Caers, J.F.J.M., Bressers, H.J.L., Janssen, J.H.J. |
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| Jazyk: | angličtina |
| Rok vydání: | 2003 |
| Zdroj: | IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies] |
| ISSN: | 1521-3331 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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