Through-polymer via (TPV) and method to manufacture such a via
| Autor: | Poelma, R.H., Van Zeijl, H., Zhang, G. |
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| Jazyk: | angličtina |
| Rok vydání: | 2014 |
| Předmět: | |
| Zdroj: | WO 2014107108 (A1) |
| Popis: | The invention relates to vias for three dimensional (3D) stacking, packaging and heterogeneous integration of semi-conductor layers and wafers. In particular, the invention relates to a process for the manufacture of a via, to a via, to a 3D circuit and to a semiconductor device. Vias are interconnects used to vertically interconnect chips, devices, interconnection layers and wafers i.e. in an out-of-plane direction. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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