Effect of Working Fluids on Cut-off Grinding of Silicon by Outer Blade

Autor:	Koshima, Kazuhiko, Onikura, Hiromichi, Sajima, Takao
Jazyk:	angličtina
Rok vydání:	2003
Předmět:	Cut-off grinding Hardware_INTEGRATEDCIRCUITS Cut-off grinding force Hardware_PERFORMANCEANDRELIABILITY Warp Slicing Mechanical damage
Zdroj:	九州大学工学紀要. 63(1):67-78
ISSN:	1345-868X
Popis:	Machining a brittle material blank into a final product, cut-off grinding process, i.e. slicing process producing the wafers from silicon ingot or dicing process dividing the wafer into chips, is one of the important machining methods. The present researc
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=jairo_______::c737fba2ac3c4aa08af30da78cea1d68 http://hdl.handle.net/2324/1128 Zobrazit plný text záznamu