Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性
| Autor: | Tanaka, Junichi, Suzuki, Naoto, Takashima, Toshiyuki, Narita, Toshio |
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| Jazyk: | japonština |
| Rok vydání: | 2004 |
| Předmět: | |
| Zdroj: | 10th Symposium on Microjoining and Assembly Technology in Electronics. :149-154 |
| Popis: | 「Mate 2004 エレクトロニクスにおけるマイクロ接合・ 実装技術シンポジウム - ブロードバンドインターネット時代に向けた生産技術革新とサイエンス」論文集収録。 We investigated interfacial dissolution reaction and thermal fatigue cycle properties for Sn-Ag-Al solder alloy/Cu. Sn-Ag-Al solder alloys showed better tensile and thermal fatigue property than Sn-3Ag-0.5Cu. The dissolution speed Cu into Sn-2Ag-0.1Al is higher than that into Sn-3Ag-0.5Cu. We guessed the difference of the morphology and the speed of crack propagation between Sn-2Ag-0.1Al and Sn-3Ag-0.5Cu was generated by changing microstructure of solder near reaction layer. |
| Databáze: | OpenAIRE |
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