Interaction Mechanism of Thermal and Mechanical Field in KDP Fly-Cutting Process
| Autor: | Xuelian Yao, Jianfeng Zhang, Haibo Li, Chenhui An, Wei Wang, Xiangyang Lei, Qiao Xu, Ke Feng |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
0209 industrial biotechnology
Materials science 02 engineering and technology engineering.material interaction mechanism Article Crystal 020901 industrial engineering & automation Phase (matter) Thermal TJ1-1570 Coupling (piping) Mechanical engineering and machinery Electrical and Electronic Engineering Composite material Inertial confinement fusion single point diamond fly-cutting Mechanical Engineering Chip formation Diamond 021001 nanoscience & nanotechnology chip morphology Stress field Control and Systems Engineering engineering potassium dihydrogen phosphate (KDP) crystal phase transition temperature 0210 nano-technology |
| Zdroj: | Micromachines Micromachines, Vol 12, Iss 855, p 855 (2021) Volume 12 Issue 8 |
| ISSN: | 2072-666X |
| Popis: | As an important nonlinear optical material, potassium dihydrogen phosphate (KDP) crystal is used in high-power laser beams as the core element of inertial confinement fusion. It is the most general method of single point diamond fly-cutting (SPDF) to produce high precision and crack-free KDP surfaces. Nevertheless, the cutting mechanism of such material remains unclear, and therefore needs further analysis. Firstly, the stress field, cutting force and cutting temperature under different working conditions are calculated by a KDP crystal cutting simulation model. Then, the rules and the cause of change and interaction mechanisms of force and temperature are analyzed by comparing the measurement experiments with simulations. Furthermore, the causes of chip formation and micro-cracks on the machined surface are analyzed based on thermo-mechanical coupling and chip morphology. The conclusion can be deduced: Although the temperature has not reached the phase transition temperature during the finishing process, under high cutting speeds and large unformed chip thickness, such as semi-finishing and roughing, the temperature can reach up to 180 °C or higher, and KDP crystals are very likely to phase transition—chip morphology also verifies this phenomenon. |
| Databáze: | OpenAIRE |
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