Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level
| Autor: | Niclas Roxhed, Mikael Antelius, Andreas Fischer, Göran Stemme, Frank Niklaus |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2012 |
| Předmět: |
010302 applied physics
Engineering drawing Fabrication Materials science Bond strength Mechanical Engineering chemistry.chemical_element 02 engineering and technology Atmospheric temperature range 021001 nanoscience & nanotechnology 01 natural sciences Electronic Optical and Magnetic Materials Boiling point chemistry Mechanics of Materials Bump bonding 0103 physical sciences Wafer Electrical and Electronic Engineering Leak rate Composite material 0210 nano-technology Helium |
| Zdroj: | Journal of Micromechanics and Microengineering |
| ISSN: | 0960-1317 |
| DOI: | 10.1088/0960-1317/22/4/045021 |
| Popis: | This paper reports a novel room-temperature hermetic liquid sealing process where the access ports of liquid-filled cavities are sealed with wire-bonded stud bumps. This process enables liquids to be integrated at the fabrication stage. Evaluation cavities were manufactured and used to investigate the mechanical and hermetic properties of the seals. Measurements on the successfully sealed structures show a helium leak rate of better than 10−10 mbarL s−1, in addition to a zero liquid loss over two months during storage near boiling temperature. The bond strength of the plugs was similar to standard wire bonds on flat surfaces. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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