Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Same
| Autor: | Remko Akkerman, Ashok Sridhar, M.A. Perik, D.J. van Dijk, J. Reiding |
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| Přispěvatelé: | Faculty of Engineering Technology |
| Rok vydání: | 2009 |
| Předmět: |
Stripline Filter
Materials science Plasma etching Fabrication business.industry Design of Experiments (DoE) Plasma Etching Substrate (printing) Surface Roughness METIS-264871 Surface energy Printed circuit board Plating Etching Printed Circuit Board (PCB) Surface roughness Electronic engineering Adhesion Optoelectronics Surface Energy IR-75472 business Inkjet Printing |
| Zdroj: | Transactions of the Japan Institute of Electronics Packaging, 2(1), 116-124. Erekutoronikusu Jisso Gakkai |
| ISSN: | 1883-3365 |
| DOI: | 10.5104/jiepeng.2.116 |
| Popis: | This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF4/O2 plasma etching, in order to make it suitable for the fabrication of RF (radio frequency) circuit structures by a combination of inkjet printing and electroless plating. A statistical DoE (design of experiments) based on a CCRD (central composite rotatable design) was used to systematically vary the plasma etching parameters and explore the characteristics of the etching process. This experimental design yielded 31 substrates, all of which were assessed in terms of surface energy, surface roughness and adhesion. Out of these substrates, 5 were identified as having the most favourable surface characteristics. Finally, RF circuit structures in the form of S-band filters were fabricated on these substrates using an inkjet printing-electroless plating combination, and the RF performance of these structures was characterised and compared. |
| Databáze: | OpenAIRE |
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