Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization
| Autor: | Yuki Kamimoto, Jae-Hyeok Park, Yuto Naruse, Ryoichi Ichino, Takeshi Bessho, Tkeshi Hagio |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
congenital
hereditary and neonatal diseases and abnormalities Materials science Compositing (democracy) diamond surface modification chemistry.chemical_element Interfacial adhesion 02 engineering and technology engineering.material 010402 general chemistry 01 natural sciences hemic and lymphatic diseases parasitic diseases General Materials Science Composite material Electroplating Electrical conductor surface functionalization interfacial adhesion Diamond 021001 nanoscience & nanotechnology Copper 0104 chemical sciences body regions composite platings chemistry engineering Surface modification 0210 nano-technology |
| Zdroj: | Functional Materials Letters. 14(05):2151023 |
| ISSN: | 1793-6047 |
| Popis: | Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionalization of diamond on the interfacial adhesion of copper and diamond in the composite. Oxygen-containing groups were introduced on the diamond surface by a hydrothermal treatment and amino groups were further introduced using a silane coupling agent. Surface functionalization of diamond with both these groups led to drastically increased wettability against the copper sulfate solution and improved the interfacial adhesion of copper and diamond in the composite. Compared with that of the plating based on pristine diamond, the thermal conductivity of the platings based on diamond functionalized with oxygen-containing groups and amino groups increased by 42 and 31 W m[Formula: see text] K[Formula: see text], respectively. Thus, diamond surface functionalization effectively improved the adhesion at the copper/diamond interface in electroplated copper/diamond composites. |
| Databáze: | OpenAIRE |
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