Analytical multi-step homogenization methodology for a stack of thin films in microelectronics
| Autor: | Adellah Tougui, P. Gardes, F. Roqueta, E. Le Bourhis, H. F. Miled, J. C. Craveur |
|---|---|
| Přispěvatelé: | Mécanique des Matériaux et Procédés (MMP), Laboratoire de Mécanique Gabriel Lamé (LaMé), Université d'Orléans (UO)-Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université d'Orléans (UO)-Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA), STMicroelectronics [Tours] (ST-TOURS), Institut Pprime (PPRIME), ENSMA-Centre National de la Recherche Scientifique (CNRS)-Université de Poitiers, Université d'Orléans (UO)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Université d'Orléans (UO)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT), Université de Poitiers-ENSMA-Centre National de la Recherche Scientifique (CNRS) |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Physics::Instrumentation and Detectors business.industry Semiconductor device modeling Mechanical engineering [PHYS.MECA.MSMECA]Physics [physics]/Mechanics [physics]/Materials and structures in mechanics [physics.class-ph] Curvature 01 natural sciences Homogenization (chemistry) Thermal expansion Finite element method Computer Science::Other [PHYS.MECA.MEMA]Physics [physics]/Mechanics [physics]/Mechanics of materials [physics.class-ph] [PHYS.MECA.STRU]Physics [physics]/Mechanics [physics]/Structural mechanics [physics.class-ph] 0103 physical sciences [PHYS.MECA.SOLID]Physics [physics]/Mechanics [physics]/Solid mechanics [physics.class-ph] Microelectronics Wafer Thin film 010306 general physics business 010303 astronomy & astrophysics ComputingMilieux_MISCELLANEOUS |
| Zdroj: | 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩ |
| Popis: | The manufacturing process causes silicon wafer curvature because of the thermomechanical mismatch between each layers and the substrate. This curvature depends on many factors such as the properties of the used materials (Young’s modulus, Poisson’s ratio, coefficient of thermal expansion), the process temperatures and the deposition route (intrinsic stress of each film). Wafer curvature has become critical, because the induced deflections lead to wafer handling issues or substrate breaking.The aim of this paper is to present a new analytical homogenization methodology to predict at production time scale the wafer curvature at any step of the process. The methodology takes into account the manufacturing process with the thermomechanical flow and the intrinsic stress. This will allow R&D engineers to estimate the curvature of new technology wafers before prototyping. Moreover, the results obtained with this methodology are validated with a comparison with a 2D axisymmetric model using the Finite Element Analysis (FEA). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|